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The purpose of this test method is to define a standard Electrical Test Method (ETM) that can be used to determine the thermal characteristics of single integrated circuit devices housed in some form of electrical package. This method will provide a basis for comparison of different devices housed in the same electronic package or similar devices housed in different electronic packages.
Author | EIA |
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Editor | EIA |
Document type | Standard |
Format | File |
ICS | 31.080.01 : Semiconductor devices in general
|
Number of pages | 36 |
Year | 1990 |
Document history | |
Country | USA |
Keyword | EIA JESD 51;EIA 51;EIA 51.1;51;EIA JESD51-1 |