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EIA JESD 51:1995
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EIA JESD 51:1995
Methodology for the Thermal Measurement of Component Packages (Single Semiconductor Device)More info
This standard and its subsequent addendum's, provides a standard for thermal measurement that, if followed fully, will provide correct and meaningful data that will allow for determination of junction temperature for specific conditions. The data can be used for package design evaluation, device characterization and reliability predictions.
| Author | EIA |
|---|---|
| Editor | EIA |
| Document type | Standard |
| Format | File |
| ICS | 31.080.01 : Semiconductor devices in general
|
| Number of pages | 8 |
| Year | 1990 |
| Document history | |
| Country | USA |
| Keyword | EIA 51;51;EIA JESD51 |