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EIA JEP 128:1996

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EIA JEP 128:1996

Guide for Standard Probe Pad Sizes and Layouts for Wafer-Level Electrical Testing

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This guide was developed to expedite inter-laboratory experiments used to evaluate or develop standard test methods that involve test-structure measurements or tests. It also facilitates, generally, any electrical tests that require wafer-probe card to make electrical contact to test structures. Widespread use of this guide will afford the efficient and cost-effective use of water-probe test stations because of the need for fewer probe cards and probe-card changes to accommodate the various test structures that may need to be tested.

Author EIA
Editor EIA
Document type Standard
Format File
ICS 19.080 : Electrical and electronic testing
Number of pages 11
Year 1990
Document history
Country USA
Keyword EIA 128;128;EIA JEP128