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This standard describes the modeling of a bond wire from an integrated circuit (IC) die to a package lead in a ball or wedge type wire bond configuration.
| Author | EIA |
|---|---|
| Editor | EIA |
| Document type | Standard |
| Format | File |
| ICS | 31.200 : Integrated circuits. Microelectronics
|
| Number of pages | 14 |
| Cross references | IEC/PAS 62170 (2000-08), IDT |
| Year | 1990 |
| Document history | |
| Country | USA |
| Keyword | EIA 59;59;EIA JESD59 |