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ASTM B579-73(2015)
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ASTM B579-73(2015)
Standard Specification for Electrodeposited Coatings of Tin-Lead Alloy (Solder Plate)More info
1.1 This specification covers the requirements for electrodeposited tin-lead coatings on fabricated articles of iron, steel, copper, and copper alloys, to protect them against corrosion (Note 1), to improve and preserve solderability over long periods of storage, and to improve anti-galling characteristics.
Note 1: Some corrosion of tin-lead coatings may be expected in outdoor exposure. In normal indoor exposure, tin-lead is protective on iron, copper, and copper alloys. Corrosion may be expected at discontinuities (pits or pores) in the coating. Porosity decreases as the thickness is increased. A primary use of the tin-lead coating (solder) is with the printed circuit industry as a solderable coating and as an etch mask material.
| Author | ASTM |
|---|---|
| Editor | ASTM |
| Document type | Standard |
| Format | File |
| Confirmation date | 2015-03-01 |
| ICS | 25.220.40 : Metallic coatings
|
| Number of pages | 5 |
| Replace | ASTM B579-73(2009) |
| Set | ASTMVOL0205 |
| Year | 1970 |
| Document history | ASTM B579-73(2009) |
| Country | USA |
| Keyword | ASTM 579;ASTM B579;ASTM B579;10.1520/B0579-73R15 |